Inventor · name-matched record
TSAI YU LING
3 granted patents·1 pending application·0 citations·filing 2022–2024
45Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0184US12550775B2Semiconductor package with stiffener structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0269US12550737B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0356US12588535B2Semiconductor device having dismantlable structure and method thereforNXP BV·Filed 2023·Granted Mar 24, 2026·0 cites·20 claims
- 0453US2026076229A13d semiconductor device with interposer and method thereforNXP BV·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →