Inventor · name-matched record
TU WEI-CHEN
2 granted patents·1 pending application·0 citations·filing 2024–2025
22Inventor score
Files withHEWLETT PACKARD ENTPR DEV LP1HEWLETT PACKARD ENTPR DEVELOPMENT LP1NATIONAL CHENG KUNG UNIV1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0162US12526949B2Cabled OCP connectorHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Granted Jan 13, 2026·0 cites·20 claims
- 0252US12595877B2Information processing device mounting systemHEWLETT PACKARD ENTPR DEVELOPMENT LP·Filed 2024·Granted Apr 7, 2026·0 cites·20 claims
- 0350US2026101733A1Semiconductor element and manufacturing method thereofNATIONAL CHENG KUNG UNIV·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →