Inventor · name-matched record
TU WEI-HSIANG
3 granted patents·3 pending applications·0 citations·filing 2022–2025
43Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0186US2026060095A1Mimcap corner structures in the keep-out zones of a semiconductor die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0275US12550710B2Semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0373US2026101742A1Stacking via configuration for advanced silicon node products and methods for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LIMITED·Filed 2025·Application pending·0 cites
- 0463US12519055B2Stacking via configuration for advanced silicon node products and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 0558US2026096465A1Passivation layer stack for stress reduction on a semiconductor die and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0654US12581935B2Stacked via structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 17, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →