Inventor · name-matched record
UNO TOMOHIRO
2 granted patents·1 pending application·0 citations·filing 2020–2025
25Inventor score
Technology areasH10W
Files withNIPPON MICROMETAL CORP3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0175US2026097454A1Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2025·Application pending·0 cites
- 0260US12581982B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2021·Granted Mar 17, 2026·0 cites·13 claims
- 0357US12532767B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Jan 20, 2026·0 cites·5 claims
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Identity basis: exact name match across USPTO filings. How scoring works →