Inventor · name-matched record
UZOH CYPRIAN EMEKA
6 granted patents·14 pending applications·0 citations·filing 2022–2025
64Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC16ADEIA SEMICONDUCTOR TECH LLC3ADEIA SEMICONDUCTOR BONDING TECH INC1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
20 records- 0197US2026041011A1Direct-bonded optoelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 0294US2026068765A1Techniques for processing devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0394US2026060053A1Metal pads over tsvADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0489US2026040922A1Structures with through-substrate vias and methods for forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0589US2026068566A1Processing stacked substratesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0688US2026047416A1Structures with through-substrate vias and methods for forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0784US12564086B2Structures for low temperature bonding using nanoparticlesADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Feb 24, 2026·0 cites·27 claims
- 0884US2026068781A1Directly bonded metal structures and methods of preparing sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0968US2026025989A1Anti-fuse devices and methods of forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1066US12557615B2Methods for bonding semiconductor elementsADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Feb 17, 2026·0 cites·23 claims
- 1166US12545010B2Directly bonded metal structures having oxide layers thereinADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 10, 2026·0 cites·18 claims
- 1265US2026026310A1Methods and systems for hybrid bonding large substratesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1363US12550799B2Direct bonding methods and structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 10, 2026·0 cites·19 claims
- 1463US2026052950A1Semiconductor elements with hybrid bonding layersADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1562US2026050009A1Probe cards and methods related theretoADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1661US2026033312A1Structures and methods for thermal dissipation in diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1761US2026033359A1Connecting element for semiconductor devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1858US12598962B2System and method for bonding transparent conductor substratesADEIA SEMICONDUCTOR BONDING TECH INC·Filed 2023·Granted Apr 7, 2026·0 cites·17 claims
- 1958US12563749B2Stacked electronic devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 24, 2026·0 cites·22 claims
- 2058US2026056229A1Compliant test probeADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →