Inventor · name-matched record
VEHONSKY JACOB
1 granted patent·3 pending applications·0 citations·filing 2021–2024
9Inventor score
Files withINTEL CORP4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0160US2026082966A1Uniform seed layer for through holes in glass substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 0258US12543578B2Electronic packaging architecture with customized variable metal thickness on same buildup layerINTEL CORP·Filed 2021·Granted Feb 3, 2026·0 cites·18 claims
- 0358US2026090432A1Methods and systems for forming integrated circuit packages comprising glass layers with thin singulated portionsINTEL CORP·Filed 2024·Application pending·0 cites
- 0457US2026005160A1Hybrid panel with a glass substrateINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →