Inventor · name-matched record
VYATSKIKH ANDREY
0 granted patents·4 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withINTEL CORP4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0161US2026090452A1Integrated circuit packages including a high thermal conductivity material coupled to a substrate with microchannels in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0261US2026090450A1Integrated circuit packages including a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0360US2026090453A1Integrated circuit packages including a structural die coupled to a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0460US2026090451A1Integrated circuit packages including a heat spreader having a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →