Inventor · name-matched record

WANG CHENGFU

0 granted patents·2 pending applications·0 citations·filing 2024–2025

Technology areasH05K

Files withGUANGDONG MINGJI HI TECH ELECTRONICS CO LTD2

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

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2 records

0159US2026068049A1Flexible printed circuit and battery packGUANGDONG MINGJI HI TECH ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
0257US2026061507A1Method and System for Soldering Flexible Printed CircuitGUANGDONG MINGJI HI TECH ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites

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Identity basis: exact name match across USPTO filings. How scoring works →