Inventor · name-matched record
WANG CHIN-HUA
4 granted patents·4 pending applications·0 citations·filing 2021–2025
57Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0195US2026076184A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0291US2026076205A1Methods of forming a semiconductor package including stress buffersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0386US12568824B2Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 3, 2026·0 cites·20 claims
- 0484US2026076206A1Package structure with a plurality of corner openings comprising different shapesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0581US12557656B2Stacking via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0677US12568820B2Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·20 claims
- 0777US2026026394A1Package and Method for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0864US12519066B2Package structure with a plurality of corner openings comprising different shapes and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 6, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →