Inventor · name-matched record

WANG I-SHI

1 granted patent·1 pending application·0 citations·filing 2023–2025

14Inventor score

Technology areasH10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD2

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0189US2026096373A1Semiconductor substrate bonding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0281US12518980B2Semiconductor substrate bonding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →