Inventor · name-matched record
WANG TSUNG-DING
4 granted patents·3 pending applications·0 citations·filing 2020–2025
57Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC1TAIWAN SEMICONDUCTOR MFG COMPANY LTD1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0198US2026083023A1Package structures and methods of making the samePARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 0297US2026060151A1Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0395US2026101806A1Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0485US12519024B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 6, 2026·0 cites·20 claims
- 0572US12588525B2Packaging substrate including an underfill injection opening and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 0668US12593704B2Three-dimensional semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·20 claims
- 0768US12568849B2Dam for three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 3, 2026·0 cites·19 claims
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Identity basis: exact name match across USPTO filings. How scoring works →