Inventor · name-matched record
Wang wei-li
3 granted patents·0 citations·filing 2023–2023
38Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0159US12563850B2Optical package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Feb 24, 2026·0 cites·15 claims
- 0249US12550463B2Sensor package structure and sensing module thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0345US12599045B2Sensor chips having columnar microstructures embedded and surrounded by adhesive layer in a package structure and manufacturing method thereofTONG HSING ELECTRONIC IND LTD·Filed 2023·Granted Apr 7, 2026·0 cites·9 claims
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Identity basis: exact name match across USPTO filings. How scoring works →