Inventor · name-matched record
WANG WEI-MING
3 granted patents·0 citations·filing 2023–2023
40Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0166US12554064B2Photonic assembly for enhanced bonding yield and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0266US12543604B2Adding sealing material to wafer edge for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 0365US12599011B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →