Inventor · name-matched record
WANG WEN-DE
2 granted patents·1 pending application·0 citations·filing 2022–2024
25Inventor score
Technology areasH10F
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0171US12557423B2Image-sensor structure and method of making thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 17, 2026·0 cites·20 claims
- 0271US12550473B2Back-trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0360US2026040711A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when WANG WEN-DE files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →