Inventor · name-matched record
WANG YEKAN
0 granted patents·9 pending applications·0 citations·filing 2024–2024
Files withINTEL CORP9
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0159US2026005084A1Microelectronic Glass-Containing Core Layer Including Clamp StructureINTEL CORP·Filed 2024·Application pending·0 cites
- 0259US2026090433A13d printing of glass core edge protection in ic device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 0358US2026005114A1Frames for glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 0457US2026005115A1Methods and systems for forming integrated circuit packages comprising glass layersINTEL CORP·Filed 2024·Application pending·0 cites
- 0557US2026005160A1Hybrid panel with a glass substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 0656US2026005159A1Reconstituted glass panel for hybrid panel manufacturingINTEL CORP·Filed 2024·Application pending·0 cites
- 0756US2026005078A1Fabricating integrated circuit packages with glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 0855US2026005081A1Hybrid glass and organic substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 0955US2026005042A1System and method for singulation of semiconductor workpieceINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →