Inventor · name-matched record
WANG ZHIJIE
1 granted patent·2 pending applications·0 citations·filing 2023–2025
9Inventor score
Technology areasH01L
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0164US2026033364A1Package interconnect structureQUALCOMM INC·Filed 2025·Application pending·0 cites
- 0260US12538759B2Methods of determining a height, and a height profile, of a wire loop on a wire bonding machineKULICKE & SOFFA IND INC·Filed 2023·Granted Jan 27, 2026·0 cites·20 claims
- 0356US2026033352A1Package comprising an integrated device with back side metallization interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →