Inventor · name-matched record
WE HONG BOK
2 granted patents·2 pending applications·1 citations·filing 2022–2024
30Inventor score
Files withQUALCOMM INC4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0185US12543599B2Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrateQUALCOMM INC·Filed 2022·Granted Feb 3, 2026·1 cites·22 claims
- 0262US12581966B2Electronic component placed on core of substrateQUALCOMM INC·Filed 2023·Granted Mar 17, 2026·0 cites·27 claims
- 0362US2026090414A1ADHERED SAP SUBSTRATE FOR CuBOL ASSEMBLY PACKAGEQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0455US2026040973A1Package substrate with core having metallization layers to facilitate signal routing within the core, and related fabrication methods and integrated circuit (ic) packagesQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →