Inventor · name-matched record
WEI CHUNG-HO
0 granted patents·2 pending applications·0 citations·filing 2024–2024
Technology areasH05K
Files withTONG HSING ELECTRONIC INDUSTRIES LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0158US2026059659A1Electronic assembly, soldering board, and oxygen-free copper layerTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0258US2026068059A1Composite ceramic substrate and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →