Inventor · name-matched record
WU KAI CHIANG
3 granted patents·4 pending applications·0 citations·filing 2023–2025
50Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0192US2026090393A1Package, package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0283US12564077B2Method of forming package structure including antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 0381US12588222B2Semiconductor package including an integrated circuit die and an inductor or a transformerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 24, 2026·0 cites·20 claims
- 0478US12593699B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·20 claims
- 0565US2026082999A1Semiconductor device and method for manufacturing the sameINTEL CORP·Filed 2024·Application pending·0 cites
- 0663US2026082994A1Semiconductor device and process for making the sameINTEL CORP·Filed 2024·Application pending·0 cites
- 0762US2026082998A1Semiconductor device and method for manufacturing the sameINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →