Inventor · name-matched record

WU SHENG-JEN

1 granted patent·1 pending application·0 citations·filing 2022–2025

13Inventor score

Technology areasH05K H10W

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

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2 records

0161US2026020162A1Substrate structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
0258US12588541B2Flip chip bonding method and chip used thereinCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Mar 24, 2026·0 cites·5 claims

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Identity basis: exact name match across USPTO filings. How scoring works →