Inventor · name-matched record
WU WEI CHENG
5 granted patents·6 pending applications·0 citations·filing 2016–2025
62Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0194US2026076210A1Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0292US2026090083A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0384US12527062B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 13, 2026·0 cites·20 claims
- 0482US12575387B2Method for fabricating a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
- 0573US2026033309A1High bandwidth package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0660US2026068747A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0759US2026033386A1Semiconductor package component, semiconductor package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0858US12548619B2Device and circuit with voltage suppressionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0956US12532728B2Backside leakage preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 1052US12550783B2Device and method for UBM/RDL routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 10, 2026·0 cites·20 claims
- 1149US2026080908A1Memory circuit and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →