Inventor · name-matched record
XU SONGHUA
1 granted patent·1 pending application·0 citations·filing 2023–2025
2Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0154US2026005209A1Wafer-scale system-in-package structure and forming method thereofJCET MICROELECTRONICS JIANGYIN CO LTD·Filed 2025·Application pending·0 cites
- 0253US12525478B2System and method of providing FOUP or cassette supporting structure for handling various size or shape wafers and panelsSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 13, 2026·0 cites·26 claims
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Identity basis: exact name match across USPTO filings. How scoring works →