Inventor · name-matched record
YAMAKAWA YUTA
0 granted patents·2 pending applications·0 citations·filing 2025–2025
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0183US2026003276A1Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor deviceFUJIFILM CORP·Filed 2025·Application pending·0 cites
- 0269US2026040990A1Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →