Inventor · name-matched record
YAN KATHY WEI
1 granted patent·8 pending applications·0 citations·filing 2023–2025
10Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0162US2026096442A1Semiconductor packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0262US2026047435A1Thermal structures for semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0362US2026076258A1Package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0461US2026052983A1Heat dissipation structure for integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0559US12593693B2Package lid with a vapor chamber base having an angled portion and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·20 claims
- 0659US2026033353A1Redistribution structures with seal rings and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0758US2026101782A1Semiconductor packages and methods of formationTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 0848US2026101752A1Heat dissipation through redistribution structureTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0946US2026096426A1Heat dissipation structure for integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →