Inventor · name-matched record
YAN MENG
3 granted patents·2 pending applications·0 citations·filing 2022–2025
42Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0193US2026090437A1Hybrid wafer bonding method and structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0279US2026082555A13d memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0370US12588495B2Bonding alignment marks at bonding interfaceYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 0469US12515271B2Angle-variable stirring and separating device for high-value components of waste PCB and control method thereofUNIV CHANGZHOU·Filed 2025·Granted Jan 6, 2026·0 cites·9 claims
- 0551US12525471B2Tape-guided pin insertion feeding mechanismsUNIV CHANGZHOU·Filed 2025·Granted Jan 13, 2026·0 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when YAN MENG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →