Inventor · name-matched record
YANG CHIH-CHAO
17 granted patents·8 pending applications·0 citations·filing 2021–2024
85Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
25 records- 0175US12538714B2Magneto-resistive random access memory with laterally-recessed free layerIBM·Filed 2023·Granted Jan 27, 2026·0 cites·24 claims
- 0269US2026090277A1Magnetoresistive random-access memory device with divided tunnel barrierIBM·Filed 2024·Application pending·0 cites
- 0368US12598986B2Metal insulator metal capacitor (MIM capacitor)INT BUSINESS MACHINES CORPORATION·Filed 2023·Granted Apr 7, 2026·0 cites·17 claims
- 0468US12598917B2Advanced MRAM device structure having hyperboloid shapeINT BUSINESS MACHINES CORPORATION·Filed 2022·Granted Apr 7, 2026·0 cites·17 claims
- 0566US12598919B2MRAM device with hammerhead profileINT BUSINESS MACHINES CORPORATION·Filed 2022·Granted Apr 7, 2026·0 cites·13 claims
- 0666US12593615B2MRAM device with wrap-around top electrode contactIBM·Filed 2022·Granted Mar 31, 2026·0 cites·17 claims
- 0766US12568772B2MRAM with a multi-component, multi-layer bottom electrodeIBM·Filed 2022·Granted Mar 3, 2026·0 cites·12 claims
- 0863US12550785B2Separated input/output (I/O) and shared power terminals for a carrier wafer with a built-in device for bonding with another device waferIBM·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0963US2026026331A1Low resistance via structureIBM·Filed 2024·Application pending·0 cites
- 1063US2026071998A1Surface acoustic wave sensor formed within an integrated circuit assemblyIBM·Filed 2024·Application pending·0 cites
- 1161US12598916B2MRAM device with self-aligned bottom electrodesINT BUSINESS MACHINES CORPORATION·Filed 2022·Granted Apr 7, 2026·0 cites·20 claims
- 1261US12593614B2MRAM device with annular electrodesIBM·Filed 2022·Granted Mar 31, 2026·0 cites·13 claims
- 1361US12550621B2Top contact structure for embedded MRAMIBM·Filed 2022·Granted Feb 10, 2026·0 cites·18 claims
- 1461US12525529B2Forming line end viasIBM·Filed 2022·Granted Jan 13, 2026·0 cites·12 claims
- 1561US2026082815A1Opposite top and bottom electrodes for memory devicesIBM·Filed 2024·Application pending·0 cites
- 1660US12575329B2Magneto-resistive random access memory with tapered sidewallsIBM·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 1760US12550620B2Top electrode to metal line connection for magneto-resistive random-access memory stack height reductionIBM·Filed 2021·Granted Feb 10, 2026·0 cites·11 claims
- 1860US12538785B2Fully-aligned and dielectric damage-less top via interconnect structureIBM·Filed 2021·Granted Jan 27, 2026·0 cites·18 claims
- 1960US2026009684A1Strain gauge sensorIBM·Filed 2024·Application pending·0 cites
- 2058US12557555B2Magnetic tunnel junction with an etched bottom electrode having non-planar sidewallsIBM·Filed 2021·Granted Feb 17, 2026·0 cites·11 claims
- 2158US12550708B2Top via interconnect with an embedded antifuseIBM·Filed 2022·Granted Feb 10, 2026·0 cites·17 claims
- 2258US2026023139A1Magnetoresistive random-access memory device with encased free layerIBM·Filed 2024·Application pending·0 cites
- 2356US2026005134A1Inductor structures in hybrid bonded devicesIBM·Filed 2024·Application pending·0 cites
- 2455US12588421B2Memory element with a hardmask stack having different stress levelsIBM·Filed 2021·Granted Mar 24, 2026·0 cites·20 claims
- 2553US2026101525A1Inductor in a bonded integrated circuit assemblyINT BUSINESS MACHINES CORPORATION·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →