Inventor · name-matched record
YANG CHIH-SUNG
0 granted patents·2 pending applications·0 citations·filing 2024–2024
Files withQUALCOMM INC2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0158US2026090059A1Semiconductor die including a transistor coupled to a contact layer wherein the contact layer includes a metal contact having a sidewall with a reduced height to promote connectivity with an adjacent viaQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0256US2026068296A1Semiconductor die including a transistor coupled to a contact layer wherein the contact layer includes a metal contact having a sidewall with a reduced height to promote connectivity with an adjacent viaQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →