Inventor · name-matched record
YANG DANFENG
4 granted patents·2 pending applications·0 citations·filing 2021–2025
52Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0158US12581965B2Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·14 claims
- 0257US2026040933A1Semiconductor Device and Method of Making a Fan-Out Quilt PackageSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0356US12593731B2Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2022·Granted Mar 31, 2026·0 cites·15 claims
- 0454US2026005209A1Wafer-scale system-in-package structure and forming method thereofJCET MICROELECTRONICS JIANGYIN CO LTD·Filed 2025·Application pending·0 cites
- 0553US12525478B2System and method of providing FOUP or cassette supporting structure for handling various size or shape wafers and panelsSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 13, 2026·0 cites·26 claims
- 0648US12550261B2Package structure with inductor, and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Granted Feb 10, 2026·0 cites·24 claims
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Identity basis: exact name match across USPTO filings. How scoring works →