Inventor · name-matched record
YANG FU-KAI
6 granted patents·1 pending application·0 citations·filing 2021–2025
67Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0186US12550407B2Semiconductor devices with backside via and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0284US12563818B2Methods of forming semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 0380US2026013206A1Isolation StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0468US12520566B2Contact structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·17 claims
- 0566US12527071B2Metal gate structure cutting processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
- 0663US12550408B2Connection between gate and source/drain featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0762US12543553B2Forming liners to facilitate the formation of copper-containing vias in advanced technology nodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 3, 2026·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when YANG FU-KAI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →