Inventor · name-matched record
YANG HYUN
0 granted patents·3 pending applications·0 citations·filing 2025–2025
Files withSAMSUNG ELECTRONICS CO LTD3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0154US2026068700A1Semiconductor package including redistribution structuresSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0253US2026040862A1Substrate loading apparatus, substrate processing system including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0348US2026076260A1Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →