Inventor · name-matched record
YAO LEI
2 granted patents·1 pending application·1 citations·filing 2023–2025
33Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0186US12516890B2Combination heat dissipation structureASIA VITAL COMPONENTS CHINA CO LTD·Filed 2023·Granted Jan 6, 2026·1 cites·11 claims
- 0278US2026010044A1Display substrate, display device and motherboardORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0359US12584695B2Combination thermal module and wick structure thereofASIA VITAL COMPONENTS CHINA CO LTD·Filed 2023·Granted Mar 24, 2026·0 cites·11 claims
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Identity basis: exact name match across USPTO filings. How scoring works →