Inventor · name-matched record
YAO WEI
4 granted patents·3 pending applications·0 citations·filing 2020–2025
54Inventor score
Files withHENKEL AG & CO KGAA1TE CONNECTIVITY SOLUTIONS GMBH1THE REGENTS OF THE UNIV OF CALIFORNIA1TYCO ELECTRONICS SHANGHAI CO LTD1UNIV CALIFORNIA1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0181US2026026503A1Compound weeding composition for sugarcane fieldUNIV GUANGXI·Filed 2024·Application pending·0 cites
- 0280US2026074477A1Connector and Electrical Connection AssemblyTE CONNECTIVITY SOLUTIONS GMBH·Filed 2025·Application pending·0 cites
- 0365US12594340B2Treating inflammation using LLP2A-bisphosphonate conjugates and mesenchymal stem cellsTHE REGENTS OF THE UNIV OF CALIFORNIA·Filed 2021·Granted Apr 7, 2026·0 cites·9 claims
- 0465US12569506B2Methods of treating osteonecrosis with LLP2A-bisphosphonate compoundsUNIV CALIFORNIA·Filed 2020·Granted Mar 10, 2026·0 cites·13 claims
- 0557US12560516B2Friction test device based on torsional Hopkinson bar (THB)UNIV TIANJIN·Filed 2023·Granted Feb 24, 2026·0 cites·8 claims
- 0656US2026045717A1Power connector system for circuit card assemblyTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2024·Application pending·0 cites
- 0755US12590228B2Curable adhesive composition for die attachHENKEL AG & CO KGAA·Filed 2020·Granted Mar 31, 2026·0 cites·16 claims
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Identity basis: exact name match across USPTO filings. How scoring works →