Inventor · name-matched record
YEE KUO-CHUNG
3 granted patents·2 pending applications·0 citations·filing 2022–2025
42Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC1TAIWAN SEMICONDUCTOR MFG COMPANY LTD1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0198US2026083023A1Package structures and methods of making the samePARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 0279US2026047414A1CHIPLETS 3D SoIC SYSTEM INTEGRATION AND FABRICATION METHODSTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0373US12543569B2Package with improved heat dissipation efficiency and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 3, 2026·0 cites·20 claims
- 0466US12543604B2Adding sealing material to wafer edge for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 0565US12599011B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →