Inventor · name-matched record
YEH JEN-HAO
1 granted patent·2 pending applications·0 citations·filing 2023–2024
10Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0176US12548694B2Thermalization of a cryogenic flex cable using a thermally conductive claddingIBM·Filed 2023·Granted Feb 10, 2026·0 cites·19 claims
- 0259US2026101792A1Method for manufacturing semiconductor stack structure with ultra thin diesNEXTHIN TECH·Filed 2024·Application pending·0 cites
- 0358US2026101686A1Method for manufacturing semiconductor stack structure with ultra thin dieNEXTHIN TECH·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →