Inventor · name-matched record
YEH KUAN-LIN
1 granted patent·2 pending applications·0 citations·filing 2024–2025
14Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0190US2026090085A1Gate Dielectric Having A Non-Uniform Thickness ProfileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0281US12520520B2Isolation structure for isolating source/drain region structure from adjacent source/drain structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 6, 2026·0 cites·20 claims
- 0377US2026082865A1Electronic package and suction deviceADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when YEH KUAN-LIN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →