Inventor · name-matched record
Yeh Shu-Shen
6 granted patents·5 pending applications·0 citations·filing 2021–2025
67Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0195US2026076184A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0294US2026011622A1High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0391US2026090423A1Semiconductor Package and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0484US12550770B2Embedded stress absorber in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0584US2026076206A1Package structure with a plurality of corner openings comprising different shapesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0681US12557656B2Stacking via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0778US12538852B2Package structure containing chip structure with inclined sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 0878US2026082936A1Dicing process in packages comprising organic interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0977US12568820B2Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·20 claims
- 1072US12557645B2Semiconductor packages with thermal lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims
- 1164US12519066B2Package structure with a plurality of corner openings comprising different shapes and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 6, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →