Inventor · name-matched record
YEN WEI
1 granted patent·2 pending applications·0 citations·filing 2022–2025
14Inventor score
Technology areasH10W
Files withND HI TECH LAB INC3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0181US2026076267A13d integrated circuit packageND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0273US12593688B2Manufacturing method of diamond composite waferND HI TECH LAB INC·Filed 2022·Granted Mar 31, 2026·0 cites·25 claims
- 0362US2026060112A1Panel-level semiconductor package structure and method for manufacturing thereofND HI TECH LAB INC·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →