Inventor · name-matched record
YEO YEE-CHIA
11 granted patents·3 pending applications·0 citations·filing 2020–2025
79Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
14 records- 0192US2026075867A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0290US2026062836A1Apparatus and Method for Use with a Substrate ChamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0386US2026096125A1Method of manufacturing semiconductor devices having metal gate structure and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0479US12557623B2Semiconductor device with connecting structure having a doped layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0577US12557602B2Wafer positioning method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 17, 2026·0 cites·20 claims
- 0677US12557367B2Source/drain regions formed using metal containing block masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0773US12557612B2Bonding system with sealing gasket and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Granted Feb 17, 2026·0 cites·20 claims
- 0871US12557314B2Gate-all-around field-effect transistor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0968US12527019B2Method of manufacturing semiconductor devices having metal gate structure and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
- 1067US12568648B2Backside source/drain contacts and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 3, 2026·0 cites·20 claims
- 1167US12532518B2Transistor source/drain regions and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 1260US12563997B2Warm wafer after ion cryo-implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 24, 2026·0 cites·20 claims
- 1360US12527070B2Method for forming wells for semiconductor devices using implanations of increasing energyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
- 1455US12538544B2Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →