Inventor · name-matched record
YOON OKSEON
1 granted patent·1 pending application·0 citations·filing 2023–2025
4Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0170US2026060128A1Method of forming semiconductor package including underfillSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0248US12525525B2Semiconductor package including redistribution structure and passivation insulating film in contact with conductive padSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →