Inventor · name-matched record
YOSHIKAWA SHUNSAKU
4 granted patents·1 pending application·1 citations·filing 2021–2025
56Inventor score
Files withSENJU METAL INDUSTRY CO5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0192US12569941B2Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit deviceSENJU METAL INDUSTRY CO·Filed 2024·Granted Mar 10, 2026·1 cites·10 claims
- 0269US12583061B2Solder alloy, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2023·Granted Mar 24, 2026·0 cites·8 claims
- 0367US2026001173A1Solder Supply MethodSENJU METAL INDUSTRY CO·Filed 2025·Application pending·0 cites
- 0463US12583060B2Solder alloy, solder ball and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Mar 24, 2026·0 cites·21 claims
- 0561US12576463B2Lead-free and antimony-free solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Mar 17, 2026·0 cites·16 claims
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Identity basis: exact name match across USPTO filings. How scoring works →