Inventor · name-matched record
YU CHEN-HUA
25 granted patents·10 pending applications·1 citations·filing 2020–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD32TAIWAN SEMICONDUCTOR MFG COMPANY LTD2PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
35 records- 0198US2026083023A1Package structures and methods of making the samePARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 0297US2026060151A1Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0395US2026076277A1Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0494US2026060105A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0592US2026090393A1Package, package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0688US12554080B2Optical connection structures for a photonic assembly and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·1 cites·20 claims
- 0786US12581977B2Bonding through multi-shot laser reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 17, 2026·0 cites·20 claims
- 0886US2026072225A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0984US12564057B2Chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 1083US12550793B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 1183US2026079308A1Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1283US2026072300A1Photonic semiconductor-insulator-semiconductor modulator and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1382US12538851B2Memory packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 27, 2026·0 cites·20 claims
- 1481US12588222B2Semiconductor package including an integrated circuit die and an inductor or a transformerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 24, 2026·0 cites·20 claims
- 1581US12557661B2Package structure with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 1680US12517298B2Integrated 3DIC with stacked photonic dies and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims
- 1779US12557690B2Package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Granted Feb 17, 2026·0 cites·20 claims
- 1879US2026076196A1Package with Heat Dissipation Structure and Method for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1979US2026047414A1CHIPLETS 3D SoIC SYSTEM INTEGRATION AND FABRICATION METHODSTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2077US12554083B2Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 2173US12599009B2Package structureTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2021·Granted Apr 7, 2026·0 cites·20 claims
- 2273US12554062B2Package devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 2373US12543569B2Package with improved heat dissipation efficiency and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 3, 2026·0 cites·20 claims
- 2472US12546935B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 2572US12517301B2Photon source and optical computing architectureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims
- 2671US12550734B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 2769US12588523B2InFO-POP structures with TIVs having cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 24, 2026·0 cites·20 claims
- 2868US12568849B2Dam for three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 3, 2026·0 cites·19 claims
- 2966US12598757B2Structure and formation method of package with hybrid interconnectionTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 3066US12554064B2Photonic assembly for enhanced bonding yield and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 3164US12532755B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 20, 2026·0 cites·20 claims
- 3263US12560829B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 24, 2026·0 cites·21 claims
- 3362US12532725B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 20, 2026·0 cites·20 claims
- 3459US12541058B2Nested waveguide fan-out structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 3558US12593632B2Method of implanting semiconductor donor substrate and method of manufacturing semiconductor-on-insulator structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·16 claims
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Identity basis: exact name match across USPTO filings. How scoring works →