Inventor · name-matched record

Yu cheng-fei

1 granted patent·0 citations·filing 2023–2023

10Inventor score

Technology areasB32B

Files withTAIWAN SEMICONDUCTOR MFG CO LTD1

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

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1 record

0168US12543526B2Fully automated wafer debonding system and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →