Inventor · name-matched record
YU YOUMIN
1 granted patent·3 pending applications·0 citations·filing 2022–2024
8Inventor score
Files withQUALCOMM INC4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0158US2026082916A1Package-on-package structure including multi-phase cooling structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0254US12588508B2Package comprising a lid structure with a compartmentQUALCOMM INC·Filed 2022·Granted Mar 24, 2026·0 cites·17 claims
- 0353US2026018487A1Mold compound embedded device cooling structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0452US2026018488A1Integrated circuit device having a two-phase thermal management deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →