Inventor · name-matched record
YUN SUN WOONG
0 granted patents·3 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withQUALCOMM INC3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0156US2026005210A1Package comprising a package interposer and a lid frame with an openingQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0256US2026005176A1Package comprising a passive device with variable sized bump interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0354US2026005076A1Device comprising a package, a lid frame, a thermal interface material and an adhesiveQUALCOMM INC·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when YUN SUN WOONG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →