Inventor · name-matched record
YUN YEOJUN
0 granted patents·6 pending applications·0 citations·filing 2024–2025
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0164US2026083029A1Semiconductor package and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0264US2026076244A1Method and an apparatus for forming an electronic deviceJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0363US2026082974A1Semiconductor Device and Method of Making Using Epoxy-Solder PasteJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0461US2026005191A1Semiconductor Device and Method of Forming Interconnect Structure in HBM Module Using VFMJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0560US2026005190A1Semiconductor Device and Method of Forming Interconnect Structure Using VFM and TCBJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0655US2026053037A1Method and an apparatus for forming an electronic deviceSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →