Inventor · name-matched record
ZHAN KAI JUN
2 granted patents·1 pending application·0 citations·filing 2022–2025
27Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0181US2026082973A1Die bonding tool with tiltable bond head for improved bonding and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0277US12550769B2Method for forming a package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0369US12519080B2Systems for fluxless bonding using an atmospheric pressure plasma and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →