Inventor · name-matched record
ZHAO LILY
1 granted patent·1 pending application·0 citations·filing 2022–2024
7Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0160US2026101805A1Package comprising a stack of integrated devices and a plurality of wire bondsQUALCOMM INCORPORATED·Filed 2024·Application pending·0 cites
- 0257US12525574B2Three-dimensional (3D) integrated circuit (IC) (3DIC) package with a bottom die layer employing an extended interposer substrate, and related fabrication methodsQUALCOMM INC·Filed 2022·Granted Jan 13, 2026·0 cites·7 claims
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Identity basis: exact name match across USPTO filings. How scoring works →