Inventor · disambiguated record

Agnes Seok-Tuan Lim

Also filed as: LIM AGNES SEOK-TUAN

1 granted patent·56 citations·filing 1998–1998

50Inventor score

Technology areasH10W

Files withINTEL CORP1

Top patents by PatentIndex Score

1 record

0176US5936848AElectronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the viasINTEL CORP·Filed 1998·Granted Aug 10, 1999·56 cites·17 claims

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