Inventor · disambiguated record

Eiji Takehara

Also filed as: TAKEHARA EIJI

1 granted patent·116 citations·filing 1996–1996

54Inventor score

Technology areasH05K

Files withTAIYO INK MFG CO LTD1

Top patents by PatentIndex Score

1 record

0190US5837155AInsulating resin composition for build-up by copper foil lamination and method for production of multilayer printed circuit board using the compositionTAIYO INK MFG CO LTD·Filed 1996·Granted Nov 17, 1998·116 cites·30 claims

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