US10014754B2ActiveUtilityPatentIndex 48
Rotary device
Est. expiryJun 20, 2034(~8 yrs left)· nominal 20-yr term from priority
Inventors:NOGUCHI MASUMI
H02K 13/04H02K 13/006H02K 13/10H02K 5/145H02K 15/00
48
PatentIndex Score
0
Cited by
14
References
12
Claims
Abstract
A rotary device having a brush that includes a slide-contact portion, a fixing section, and a conductive bonding material. The conductive bonding material bonds together the slide-contact portion and the fixing section. The conductive bonding material is composed of an intermetallic compound phase that is an alloy containing one of (1) at least two selected from a first group consisting of Sn, Cu and Ni, and (2) at least two selected from a second group consisting of Sn, Cu, and Mn.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. A rotary device comprising:
a first piece having a slide-contact face that contacts a rotating object of the rotary device;
a second piece; and
a conductive bonding material bonding the first piece to the second piece, the conductive bonding material including an intermetallic compound that is an alloy containing one of (1) at least two selected from a first group consisting of Sn, Cu and Ni, and (2) at least two selected from a second group consisting of Sn, Cu, and Mn,
wherein the conductive bonding material is a porous material.
2. The rotary device according to claim 1 , wherein the intermetallic compound if the result of a reaction between a first metal which is Sn or an alloy including Sn and a second metal which is a CuNi alloy, a CuMn alloy, an AgPd alloy, a CuAl alloy, or a CuCr alloy.
3. The rotary device according to claim 2 , wherein the first metal is an Sn powder and the second metal is a CuNi alloy powder.
4. The rotary device according to claim 3 , wherein the Sn powder has an average D50 particle size within a range of 5 to 50 μm, and the CuNi alloy powder has an average D50 particle size within a range of 0.1 to 80 μm.
5. The rotary device according to claim 1 , wherein the intermetallic compound includes a CuNiSn alloy.
6. The sliding member according to claim 1 , wherein the intermetallic compound is one of Cu 6 Sn 5 , Ni 3 Sn 4 and Cu 2 NiSn.
7. The sliding member according to claim 1 , wherein the conductive bonding material has a porosity of 5 to 50%.
8. The rotary device according to claim 1 , wherein the conductive bonding material further includes at least one of a first alloy layer on a surface of the first piece and a second alloy layer on a surface of the second piece.
9. The rotary device according to claim 1 , wherein the conductive bonding material further includes a first alloy layer on a surface of the first piece and a second alloy layer on a surface of the second piece.
10. The rotary device according to claim 1 , wherein
the first piece is configured as a portion of a brush to serve as a slide-contact portion that contacts a commutator of the rotary device, and
the second piece is configured as a fixing section which connects to the rotary device.
11. The rotary device according to claim 1 , wherein
the first piece is configured as a brush of the rotary device, and
the second piece is configured as a supporting portion that supports the brush.
12. The rotary device according to claim 1 , wherein
the first piece is configured as a commutator of the rotary device; and
the second piece is configured as a coil connected to the commutator.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.